RV1126 Module Development Board EVB

Rockchip RV1126 Development Board Core Board IPC RV1109 AI SDK Software Development Kit vcan1748


Front View

Back View

Product Applications

Intelligent IPC, Face Recognition Panel Machine, Face Capture Camera, Video Doorbell, No Network, and No Power Camera, Express Handheld, GPS Navigation, Man-Machine Interface, Monitoring Equipment, Drone Pod, Video Conferencing System, etc.

Front View Specification

  1. SOC RV1126, Pin to Pin compatible with RV1109;

  2. DDR3L (Samsung K4B4G1646E BCNB)

    1. A 4G bit DDR3 K4B4G1646E BCNB is attached to the front and back of the entire board, with a total of 8G bit DDR3;

  3. SPI Nand Flash:

    1. Version A is equipped with 2G bit SPI Nand Flash XT26G02AWSEGA

    2. Version B is equipped with 4G bit SPI Nand Flash XT26G04AWSEGA

  4. RMII PHY (RTL8201F)

  5. Codec (ES8311)

  6. Transformer (Network isolation transformer MS10232ANL)

  7. RTC (BM8563)

  8. USB Connector

    1. Pin1: VCC5V0_OTG

    2. Pin2: OTG_DM

    3. Pin3: OTG_DP

    4. Pin4: GND

  9. Ethernet&Power Jack

    1. Pin1: TX+

    2. Pin2: TX-

    3. Pin3: RX+

    4. Pin4: POE45

    5. Pin5: POE45

    6. Pin6: RX-

    7. Pin7: POE78

    8. Pin8: POE78

    9. Pin9: GND

    10. Pin10: VCC12V_DCIN

  10. Audio Connector

    1. Pin1: LED1/PHYAD1

    2. Pin2: LED0/PHYAD0

    3. Pin3: RESET

    4. Pin4: MICP

    5. Pin5: GND

    6. Pin6: LINE_OUT

Back View Specification

1.DDR3L (Samsung K4B4G1646E BCNB)

A 4Gbit DDR3 is attached to the front and back of the entire board, with a total of 8G bits;

2. MIPI DSI Connector

  1. Pin1: IRQ

  2. Pin2: PWR_EN

  3. Pin3: RST

  4. Pin4: I2C3_SDA

  5. Pin5: I2C3_SCL

  6. Pin6: GND

  7. Pin7: MIPI_DSI_D2P

  8. Pin8: MIPI_DSI_D2N

  9. Pin9: MIPI_DSI_D1P

  10. Pin10: MIPI_DSI_D1N

  11. Pin11: MIPI_DSI_D3N

  12. Pin12: MIPI_DSI_D3P

  13. Pin13: MIPI_DSI_D0N

  14. Pin14: MIPI_DSI_D0P

  15. Pin15: GND

  16. Pin16: MIPI_DSI_CLKN

  17. Pin17: MIPI_DSI_CLKP

  18. Pin18: GND

  19. Pin19: VCC_12V

  20. Pin20: VCC_12V

4. Function Connector

  1. Pin1: HOST_DM

  2. Pin2: HOST_DP

  3. Pin3: GND

  4. Pin4: GND

  5. Pin5: ALARM_IN

  6. Pin6: SDMMC0_DET

  7. Pin7: ALARM_OUT

  8. Pin8: SDMMC0_PWREN

  9. Pin9: SDMMC0_D2

  10. Pin10: USB_PWREN

  11. Pin11: SDMMC0_CMD

  12. Pin12: GND

  13. Pin13: SDMMC0_D1

  14. Pin14: SDMMC0_D0

  15. Pin15: SDMMC0_CLK

  16. Pin16: SDMMC0_D3

  17. Pin17: RS485_CTL

  18. Pin18: UART3_RX_485

  19. Pin19: UART3_TX_485

  20. Pin20: GND

  21. Pin21: VCC_12V

  22. Pin22: VCC_12V

  23. Pin23: POE45

  24. Pin24: POE78

  25. Pin25: POE36

  26. Pin26: POE12

3.MIPI CSI Connector

  1. Pin1: VCC3V3_SYS

  2. Pin2: VCC3V3_SYS

  3. Pin3: SPI0_CLK

  4. Pin4: LED_PWM

  5. Pin5: SPI0_CS0N

  6. Pin6: SPI0_MISO

  7. Pin7: SPI0_MOSI

  8. Pin8: I2C1_SDA

  9. Pin9: I2C1_SCL

  10. Pin10: MIPI_RX0_PDN

  11. Pin11: MIPI_RX0_RST

  12. Pin12: GND

  13. Pin13: MIPI_CSI_RX0_CLKP

  14. Pin14: MIPI_CSI_RX0_CLKN

  15. Pin15: GND

  16. Pin16: MIPI_CSI_RX0_D2P

  17. Pin17: MIPI_CSI_RX0_D2N

  18. Pin18: MIPI_CSI_RX0_D3P

  19. Pin19: MIPI_CSI_RX0_D3N

  20. Pin20: MIPI_CSI_RX0_D1P

  21. Pin21: MIPI_CSI_RX0_D1N

  22. Pin22: MIPI_CSI_RX0_D0P

  23. Pin23: MIPI_CSI_RX0_D0N

  24. Pin24: GND

  25. Pin25: MIPI_CSI_CLK0

  26. Pin26: GND

  27. Pin27: PWM8

  28. Pin28: IRC_AIN

  29. Pin29: PWM11

  30. Pin30: PWM9

  31. Pin31: IRC_BIN

  32. Pin32: ZOOM_EN

  33. Pin33: PWM10

  34. Pin34: P-IRIS_EN

  35. Pin35: FOCUS_EN

  36. Pin36: ADC_IN

  37. Pin37: GND

  38. Pin38: VCC_1V8

  39. Pin39: VCC_12V

  40. Pin40: VCC_12V

1.1 Overview

RV1126 is a high-performance vision processor SoC for IPC/CVR, especially for AI-related applications. It is based on a quad-core ARM Cortex-A7 32-bit core which integrates NEON and FPU. There is a 32KB I-cache and 32KB D-cache for each core and a 512KB unified L2 cache. The build-in NPU supports INT8/INT16 hybrid operation and computing power is up to 2.0TOPs. In addition, with its strong compatibility, network models based on a series of frameworks such as TensorFlow/MXNet/PyTorch/Caffe can be easily converted.<br>

RV1126 also introduces a new generation totally hardware-based 14-megapixel ISP (image signal processor) and post-processor. It implements a lot of algorithm accelerators usually used in IPC and CVR, such as HDR, 3A functions (AE, AF, AWB), LSC, 3DNR, 2DNR, sharpening, dehaze, fisheye correction, gamma correction, feature points detection and so on. All of them are real-time processing. Cooperating with two MIPI CSI (or LVDS/SubLVDS) and one DVP (BT.601/BT.656/BT.1120) interface, users can build a system that receives video data from 3 camera sensors simultaneous.

The video encoder embedded in RV1126 supports UHD H.265/H.264 encoding. It also supports multi-stream encoding, up to one 4Kp30 and one 1080p30 simultaneous. With the help of this feature, the video from the camera can be encoded with higher resolution and stored in local memory and transferred to another lower resolution video to cloud storage at the same time. The H.264/H.265 video decoder in RV1126 supports 4Kp30 for H.264 and H.265.

In addition to the previous high-performance multimedia block, RV1126 also contains rich audio, memory, and other peripheral interfaces such as I2C, SPI, PWM, and so on. These can help users add more sensors or other peripherals into the whole system to improve flexibility and expansibility.

RV1126 has high-performance external DRAM (DDR3/DDR3L/DDR4/LPDDR3/LPDDR4-2133) capable of sustaining demanding memory bandwidths.

1.2 Features

The features listed below which may or may not be present in an actual product may be subject to the third-party licensing requirements. Please contact Rockchip for actual product feature configurations and licensing requirements.

1.2.1 Application Processor

Quad-Core Cortex-A7

Full implementation of the ARM architecture v7-A instruction set, ARM Neon Advanced SIMD

Separately Integrated Neon and FPU

32KB L1 I-Cache and 32KB L1 D-cache per Cortex-A7 CPU

Unified 512KB L2 Cache for Quad-Core Cortex-A7

TrustZone technology supported

Separate power domains for CPU core system to support internal power switch and externally turn on/off based on the different application scenario

PD_CPU0: 1st Cortex-A7 + Neon + FPU + L1 I/D Cache

PD_CPU1: 2nd Cortex-A7 + Neon + FPU + L1 I/D Cache

PD_CPU2: 3rd Cortex-A7 + Neon + FPU + L1 I/D Cache

PD_CPU3: 4th Cortex-A7 + Neon + FPU + L1 I/D Cache

One isolated voltage domain to support DVFS

1.2.2 Video Input Interface

Interface and video input processor

Two MIPI CSI/ LVDS/SubLVDS interfaces, 4 lanes each, MIPI CSI max data rate is 2.5Gbps/lane, LVDS/SublVDS max data rate is 1Gbps/lane

On 8/10/12/16-bit standard DVP interface, up to 150MHz input data

Support BT.601/BT.656 and BT.1120 VI interfaces

Support the polarity of pixel_clk、hsync、vsync configurable

<span style=”color: #ffffff;”>RV1126 Datasheet Rev 1.4</span>

ISP

The maximum resolution is 14Mpixel(4416×3312)

DVP input: ITU-R BT.601/656/1120 with raw8/raw10/raw12/raw16, YUV422

MIPI input: RX data lane x1/x2/x4, raw8/raw10/raw12, YUV422

3A: include AE/Histogram, AF, AWB statistics output

FPN: Fixed Pattern Noise removal

BLC: Black Level Correction

DPCC: Static/Dynamic defect pixel cluster correction

LSC: Lens shading correction

Bayer-NR: Bayer-raw De-noising, 2DNR

HDR: 3-/2-Frame Merge into High-Dynamic Range

TMO: 3-/2-Frame Merge Video Tone mapping

WDR: One Frame Wide-Dynamic Range Tone mapping

Debayer: Advanced Adaptive Demosaic with Chromatic Aberration Correction

CCM/CSM: Color correction matrix; RGB2YUV etc.

Gamma: Gamma out correction

Dehaze/Enhance: Automatic Dehaze and edge enhancement

3DLUT: 3D-Lut Color Palette for Customer

LDCH: Lens distortion in the horizontal direction

Output Scale*3: support scale down level*3(W0&lt;3264; W1&lt;1280; W2&lt;1280)

Output Scale*2: support scale down level*2(W0&lt;1920; W1&lt;1920)

Output (FBC): support YUV422/420 with Frame Buffer Compression

3DNR: Advanced Temporal Noise reduce in YUV

2DNR: Advanced Spatial Noise reduce in YUV

Sharp: Picture Sharpening &amp; Edge Enhance in YUV

ORB: Oriented Fast and Rotated BRIEF, a method of feature points detection

FEC: the bigger Lens-distortion and Fish Eye Correction

CGC: Color Gamut Compression, YUV full range/limit range convert

1.2.3 Video CODEC

Video Decoder

Real-time decoding of H.264 and H.265

Main and Main10 profile for H.265, up to level 5.0 and 4096×2304 30fps

Baseline, main, high, high10 and high 4:2:2(without MBAFF), up to level 5.1 and 4096×2304 30fps

Video Encoder

Real-time UHD H.265/H.264 video encoding

I-/P-frames and SmartP reference.

Five-bit rate control modes (CBR, VBR, FixQp, AVBR, and QpMap)

Up to 100 Mbit/s output bit rate

Support ROI(no limit) encoding;

High profile for H.264, up to level 5.1 and 4096×2304 at 30fps

Main profile for H.265, up to level 5.0 and 4096×2304 at 30fps

Support multi-stream encoding

3840 x 2160 at 30 fps + 1080p at 30 fps encoding

3840 x 2160 at 30 fps encoding + 3840 x 2160 at 30 fps decoding

Input data format:

YCbCr 4:2:0 planar

YCbCr 4:2:0 semi-planar

YCbYCr 4:2:2

CbYCrY 4:2:2 interleaved

RGB444 and BGR444

RGB555 and BGR555

RGB565 and BGR565

RGB888 and BRG888

RGB101010 and BRG101010

<span style=”color: #ffffff;”>RV1126 Datasheet Rev 1.4</span>

One isolated voltage domain to support DVFS

1.2.4 JPEG CODEC

JPEG Encoder

Baseline (DCT sequential)

Encoder size is from 96×96 to 8192×8192(67Mpixels)

Up to 90 million pixels per second

JPEG Decoder

Decoder size is from 48×48 to 8176×8176(66.8Mpixels)

Up to 76 million pixels per second

1.2.5 Neural Process Unit

Neural network acceleration engine with processing performance up to 2.0 TOPS

Support integer 8, integer 16 convolution operation

Support deep-learning frameworks: TensorFlow, TF-lite, Pytorch, Caffe, ONNX, MXNet, Keras, Darknet

Support OpenVX API

One isolated voltage domain to support DVFS

1.2.6 Memory Organization

Internal on-chip memory

BootRom

SYSTEM_SRAM in the voltage domain of VD_LOGIC

PMU_SRAM in the voltage domain of VD_PMU for low power application

External off-chip memory

DDR3/DDR3L/DDR4/LPDDR3/LPDDR4-2133①

SPI Flash

eMMC

SD Card

Async Nand Flash

1.2.7 Internal Memory

Internal BootRom

Support system boot from the following device:

FSPI Flash interface

eMMC interface

SDMMC interface

Async Nand interface

Support system code download by the following interface:

USB OTG interface (Device mode)

SYSTEM_SRAM

Size: 64KB

PMU_SRAM

Size: 8KB

1.2.8 External Memory or Storage device

Dynamic Memory Interface (DDR3/DDR3L/DDR4/LPDDR3/LPDDR4-2133)

Compatible with JEDEC standards

Compatible with DDR3/DDR3L/DDR4/LPDDR3/LPDDR4-2133

Support 32-bit data width, 2 ranks (chip selects), max 4GB addressing space per rank, total addressing space is 4GB (max)

Low power modes, such as power-down and self-refresh for SDRAM

eMMC Interface

Compatible with standard iNAND interface

Compatible with eMMC specification 4.51

Support three data bus widths: 1-bit, 4-bit or 8-bit

Support up to HS200; but not support CMD Queue

<span style=”color: #ffffff;”>RV1126 Datasheet Rev 1.4</span>

SD/MMC Interface

Compatible with SD3.0, MMC ver4.51

Data bus width is 4bits

Flexible Serial Flash Interface(FSPI)

Support transfer data from/to serial flash device

Support x1, x2, x4 data bits mode

Support 2 chips select

Nand Flash Interface

Support async nand flash

Data bus width is 8bits

Support 1 chip select

Support LBA nand flash

Up to 16bits/1KB hardware ECC

Support configurable interface timing

1.2.9 System Component

RISC-V MCU

32bit microcontroller core with RISC -V ISA

Harvard architecture, separate Instruction, and Data memories

The instruction set is RV32I with M and C extensions

Integrated Programmable Interrupt Controller (IPIC), all 123 IRQ lines connected to GIC for Cortex-A7 also connect to RISC –V MCU

Integrated Debug Controller with JTAG interface

CRU (clock &amp; reset unit)

Support clock gating control for individual components

One oscillator with 24MHz clock input

Support global soft-reset control for the whole chip, also individual soft-reset for each component

PMU (power management unit)

Support 5 separate voltage domains VD_CORE/VD_LOGIC/VD_PMU/VD_NPU/VD_VEPU

Support 14 separate power domains, which can be powered up/down by software based on different application scenes

Multiple configurable work modes to save power by different frequency or automatic clock gating control or power domain on/off control

Timer

Support 6 64bit-timers with the interrupt-based operation for non-secure application

Support 2 64bit-timers with the interrupt-based operation for secure application

Support two operation modes: free-running and user-defined count

Support timer work state checkable

PWM

Support 12 on-chip PWMs (PWM0~PWM11) with the interrupt-based operation

The programmable pre-scaled operation to bus clock and then further scaled

Embedded 32-bit timer/counter facility

Support capture mode

Support continuous mode or one-shot mode

Provides reference mode and outputs various duty-cycle waveform

Optimized for IR application for PWM3, PWM7, and PWM11

Watchdog

32-bit watchdog counter

The counter counts down from a preset value to 0 to indicate the occurrence of a timeout

WDT can perform two types of operations when the timeout occurs:

Generate a system reset

First, generate an interrupt and if this is not cleared by the service routine by the time a second timeout occurs then generate a system reset

Programmable reset pulse length

<span style=”color: #ffffff;”>RV1126 Datasheet Rev 1.4</span>

Totally 16 defined ranges of the main timeout period

One Watchdog for non-secure application

One Watchdog for secure application

Interrupt Controller

Support 128 SPI interrupt sources input from different components

Support 16 software-triggered interrupts

Two interrupt outputs (nFIQ and nIRQ) separately for each Cortex-A7, both are low-level sensitive

Support different interrupt priorities for each interrupt source, and they are always software-programmable

DMAC

Micro-code programming-based DMA

Linked list DMA function is supported to complete scatter-gather transfer

Support data transfer types with memory-to-memory, memory-to-peripheral, peripheral-to-memory

Signals the occurrence of various DMA events using the interrupt output signals

One embedded DMA controller for the system

DMAC features:

Support 8 channels

27 hardware requests from peripherals

2 interrupts output

Support TrustZone technology and programmable secure state for each DMA channel

Secure System

Cipher engine

Support SM2/SM3/SM4 cipher

Support SHA-1, SHA-256/224, SHA-512/384, and MD5 with hardware padding

Support Link List Item (LLI) DMA transfer

Support AES-128 AES-256 encrypt &amp; decrypt cipher

Support AES ECB/CBC/OFB/CFB/CTR/CTS/XTS mode

Support DES &amp; TDES encrypt &amp; decrypt cipher

Support DES/TDES ECB/CBC/OFB/CFB mode

Support up to 4096 bits PKA mathematical operations for RSA/ECC

Support up to 8-channel configuration

Support Up to 256 bits of TRNG output

Support data scrambling for all DDR types

Support secure OTP

Support secure debug

Support secure OS

Mailbox

One Mailbox in SoC to service A7 and RISC-V MCU communication

Support four mailbox elements per mailbox, each element includes one data word, one command word register, and one flag bit that can represent one interrupt

Provide 32 lock registers for software to use to indicate whether the mailbox is occupied

DECOM

Support for decompressing GZIP files

Support for decompressing LZ4 files, including the General Structure of LZ4 Frame format and the Legacy Frame format.

Support for decompressing data in Deflate format

Support for decompressing data in ZLIB format

Support complete interrupt and error interrupt output

Support Hash32 check in the LZ4 decompression process

Support the limit size function of the decompressed data to prevent the memory from being maliciously destroyed during the decompression process

Support software to stop the decompression process

<span style=”color: #ffffff;”>RV1126 Datasheet Rev 1.4</span>

1.2.10 Graphics Engine

2D Graphics Engine (RGA):

Source formats:

ABGR8888, XBGR888, ARGB8888, XRGB888

RGB888, RGB565

RGBA5551, RGBA4444

YUV420 planar, YUV420 semi-planar

YUV422 planar, YUV422 semi-planar

YUV 10-bit for YUV420/422 semi-planar

BPP8, BPP4, BPP2, BPP1

Destination formats:

ABGR8888, XBGR888, ARGB8888, XRGB888

RGB888, RGB565

RGBA5551, RGBA4444

YUV420 planar, YUV420 semi-planar

YUV422 planar, YUV422 semi-planar

Pixel Format conversion, BT.601/BT.709

Max resolution: 8192×8192 source, 4096×4096 destination

BitBlt

Two sources BitBLT:

A+B=B only BitBLT, A support rotate and scale when B fixed

A+B=C second source (B) has the same attribute as (C) plus rotation function

Color fill with a gradient fill, and pattern fill

High-performance stretch and shrink

Monochrome expansion for text rendering

New comprehensive per-pixel alpha (color/alpha channel separately)

Alpha blending modes including Java 2 Porter-Duff compositing blending rules, chroma key, pattern mask, fading

Dither operation

0, 90, 180, 270-degree rotation

x-mirror, y-mirror, and rotation operation

Image Enhancement Processor (IEP):

Image format

Input data: YUV420/YUV422, semi-planar/planar, UV swap

Output data: YUV420/YUV422, semi-planar, UV swap, Tile mode

YUV down sampling conversion from 422 to 420

Max resolution for dynamic image up to 1920×1080

De-interlace

1.2.11 Display Interface

One up to 24 bits RGB parallel video output interface

One BT.1120 video output interface

One 4-lane MIPI DSI interface, up to 1Gbps per lane

Up to 1080p at 60fps

1.2.12 Video Output Processor (VOP)

Up to 1920×1080 at 60fps

Multiple layers

Background layer

Win0 layer

Win2 layer

Input format: RGB888, ARGB888, RGB565, YCbCr422, YCbCr420, YCbCr444

1/8 to 8 scaling-down and scaling-up engine

Support virtual display

256 level alpha blending (pre-multiplied alpha support)

Transparency color key

<span style=”color: #ffffff;”>RV1126 Datasheet Rev 1.4</span>

YCbCr2RGB (rec601-mpeg/ rec601-jpeg/rec709)

RGB2YCbCr (BT.601/BT.709)

Support multi-region

Win0 layer and Win2 layer overlay exchangeable

Support RGB or YUV domain overlay

BCSH (Brightness, Contrast, Saturation, Hue adjustment)

BCSH: YCbCr2RGB (rec601-mpeg/ rec601-jpeg/rec709)

BCSH: RGB2YCbCr (BT.601/BT.709)

Support Gamma adjust

Support dither down allegro RGB888to666 RGB888to565 &amp; dither down FRC (configurable) RGB888to666

Blank and black display

1.2.13 Audio Interface

I2S0 with 8 channels

Up to 8 channels TX and 8 channels RX path

Audio resolution from 16bits to 32bits

Sample rate up to 192KHz

Provides master and slave work mode, software configurable

Support 3 I2S formats (normal, left-justified, right-justified)

Support 4 PCM formats (early, late1, late2, late3)

I2S and PCM mode cannot be used at the same time

I2S1/I2S2 with 2 channels

Up to 2 channels for TX and 2 channels RX path

Audio resolution from 16bits to 32bits

Sample rate up to 192KHz

Provides master and slave work mode, software configurable

Support 3 I2S formats (normal, left-justified, right-justified)

Support 4 PCM formats (early, late1, late2, late3)

I2S and PCM cannot be used at the same time

PDM

Up to 8 channels

Audio resolution from 16bits to 24bits

Sample rate up to 192KHz

Support PDM master receive mode

TDM

Support up to 8 channels for TX and 8 channels for RX path

Audio resolution from 16bits to 32bits

Sample rate up to 192KHz

Provides master and slave work mode, software configurable

Support 3 I2S formats (normal, left-justified, right-justified)

Support 4 PCM formats (early, late1, late2, late3)

Audio PWM

Support convert PCM to PWM format

Sample rate up to 16x

Support linear interpolation for 2x/4x/8x/16 oversampling

Support 8/9/10/11 bits maskable L/R channel PWM output

Digital Audio Codec

Support 3-channel digital ADC

Support 2-channel digital DAC

Support I2S/PCM interface

Support I2S/PCM master and slave mode

Support 4-channel audio transmitting in I2S mode

Support 2-channel audio receiving in I2S mode

Support 2-channel audio transmitting or receiving in PCM mode

Support 16~24 bit sample resolution for both digital ADC and digital DAC

<span style=”color: #ffffff;”>RV1126 Datasheet Rev 1.4</span>

Both digital ADC and digital DAC support three groups of sample rates. Group 0 are 8khz/16khz/32kHz/64kHz/128khz, group 1 are 11.025khz/22.05khz/44.1khz/88.2khz/176.4khz and group 2 are 12khz/24khz/48khz/96khz/192khz

The passband of digital ADC filters is 0.45625*fs

Support digital ADC pass-band ripple within +/-0.1dB

The stop-band of digital ADC filters is 0.5*fs

Support digital ADC stop-band attenuation of at least 60dB

Support volume control for both digital ADC and digital DAC

Support Automatic Level Control (ALC)and noise gate for digital ADC

Support communication with Analog Codec through I2C bus

1.2.14 Connectivity

SDIO Interface

Compatible with SDIO3.0 protocol

4bits data bus widths

GMAC 10/100/1000M ethernet controller

Support 10/100/1000-Mbps data transfer rates with the RGMII interfaces

Support 10/100-Mbps data transfer rates with the RMII interfaces

Support both full-duplex and half-duplex operation Support for TCP Segmentation Offload (TSO) and UDP Segmentation Offload (USO) network acceleration<br>

USB 2.0 Host

Compatible with USB 2.0 specification

Supports high-speed(480Mbps), full-speed(12Mbps) and low-speed(1.5Mbps) mode

Support Enhanced Host Controller Interface Specification (EHCI), Revision 1.0

Support Open Host Controller Interface Specification (OHCI), Revision 1.0a

USB 2.0 OTG

Compatible Specification

Universal Serial Bus Specification, Revision 2.0

Extensible Host Controller Interface for Universal Serial Bus (xHCI), Revision 1.1

Support Control/Bulk/Interrupt/Isochronous Transfer

SPI Interface

Support 2 SPI Controllers, support two chip-select output

Support serial-master and serial-slave mode, software-configurable

I2C Interface

Support 6 I2C interfaces(I2C0-I2C5)

Support 7bits and 10bits address mode

Software programmable clock frequency

Data on the I2C-bus can be transferred at rates of up to 100k bits/s in the Standard mode, up to 400k bits/s in the Fast mode, or up to 1m bits/s in Fast-mode Plus

UART Interface

Support 6 UART interfaces (UART0-UART5)

Support 5bit, 6bit, 7bit, and 8bit serial data transmit or receive

Standard asynchronous communication bits such as start, stop, and parity

Support different input clocks for UART operation to get up to 4Mbps baud rate

Support auto flow control mode(except UART2)

1.2.15 Others

Multiple Groups of GPIO

All of GPIOs can be used to generate an interrupt

Support level trigger and edge trigger interrupt

Support configurable polarity of level trigger interrupt

Support configurable rising edge, falling edge, and both edge trigger interrupt

Support configurable pull direction (a weak pull-up and a weak pull-down)

<strong>RV1126 Datasheet Rev 1.4</strong>

Support configurable drive strength

Temperature Sensor (TS-ADC)

Support User-Defined Mode and Automatic Mode

In User-Defined Mode, start_of_conversion can be controlled completely by software, and also can be generated by hardware.

In Automatic Mode, the temperature of alarm(high/low temperature) interrupt can be configurable

In Automatic Mode, the temperature of the system reset can be configurable

Support to 2 channel TS-ADC (used for CPU and NPU respectively), the temperature criteria of each channel can be configurable

-40~125°C temperature range and 5°C temperature resolution

12-bit SAR ADC up to 732 S/s sampling rate

Successive approximation ADC (SAR ADC)

10-bit resolution

Up to 1MS/s sampling rate

6 single-ended input channels

OTP

Support 32Kbit space and higher 4k address space is a non-secure part.

Support read and program word mask in a secure model

Support program length from 1 to 32 bit

Read operation support 8bit only

Program and Read state can be read

The program fails to address the record

Package type

FCCSP 409-pin (body: 14mm x 14mm; Ball size: 0.3mm; ball pitch: 0.65mm)

Notes:

①: DDR3/DDR3L/DDR4/LPDDR3/LPDDR4 is not used simultaneously